{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504867","patent":{"patent_number":"US-10504867","title":"Semiconductor device having a bonding pad","assignee":null,"inventors":[],"filing_date":"2016-06-27T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor device has a bonding pad and a wiring layer formed on an insulating film. The wiring layer is spaced from the bonding pad by a gap. A passivation film covers the bonding pad and the wiring layer and fills the gap. The gap has a width equal to or larger than the thickness of the passivation film, and equal to or smaller than twice a side wall thickness of the passivation film covering a side wall of the wiring layer. The semiconductor device has a high resistance to stress during bonding."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having a bonding pad","description":"A semiconductor device has a bonding pad and a wiring layer formed on an insulating film. The wiring layer is spaced from the bonding pad by a gap. A passivation film covers the bonding pad and the wi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504867","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504867","citation_suggestion":"Patentable. \"Semiconductor device having a bonding pad\" (US-10504867). https://patentable.app/patents/US-10504867","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504867","json":"https://patentable.app/api/llm-context/US-10504867","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:19:33.927Z"}