{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504915","patent":{"patent_number":"US-10504915","title":"Integrated circuit device having an air gap between interconnects and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-09-16T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"An integrated circuit device includes a first insulating film, a second insulating film provided on the first insulating film, and having a composition different from a composition of the first insulating film, a first interconnect extending in a first direction crossing a vertical direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film, and a second interconnect extending in the first direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film. An air gap is formed in the first insulating film and in the second insulating film and also between the first interconnect and the second interconnect. A lower end of the air gap is located lower than a lower surface of the first interconnect and a lower surface of the second interconnect."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit device having an air gap between interconnects and method for manufacturing the same","description":"An integrated circuit device includes a first insulating film, a second insulating film provided on the first insulating film, and having a composition different from a composition of the first insula","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504915","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504915","citation_suggestion":"Patentable. \"Integrated circuit device having an air gap between interconnects and method for manufacturing the same\" (US-10504915). https://patentable.app/patents/US-10504915","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504915","json":"https://patentable.app/api/llm-context/US-10504915","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:08:36.913Z"}