{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10504943","patent":{"patent_number":"US-10504943","title":"Method for manufacturing an array substrate motherboard","assignee":null,"inventors":[],"filing_date":"2017-01-11T00:00:00.000Z","publication_date":"2019-12-10T00:00:00.000Z","cpc_codes":["G02F","G02F","G02F","G02F","G02F","H01L","G02F","G02F","G02F","G02F"],"num_claims":11,"abstract":"An array substrate motherboard, a manufacturing method thereof and a display device are provided. The manufacturing method includes forming a film layer pattern for a first display product at a first region of a base substrate and forming a film layer pattern for a second display product at a second region of the base substrate. The first display product has deep holes at a density larger than the second display product, and each deep hole is a via-hole penetrating through at least two insulation layers. Specifically, the manufacturing method include: prior to forming a second conductive pattern on an insulation layer, reducing a thickness of the insulation layer at the first region; and forming the second conductive pattern on the insulation layer, and enabling the second conductive pattern to be connected to a first conductive pattern under the insulation layer through a via-hole structure penetrating through the insulation layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing an array substrate motherboard","description":"An array substrate motherboard, a manufacturing method thereof and a display device are provided. The manufacturing method includes forming a film layer pattern for a first display product at a first ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10504943","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10504943","citation_suggestion":"Patentable. \"Method for manufacturing an array substrate motherboard\" (US-10504943). https://patentable.app/patents/US-10504943","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10504943","json":"https://patentable.app/api/llm-context/US-10504943","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:59:46.148Z"}