{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10508029","patent":{"patent_number":"US-10508029","title":"MEMS integrated pressure sensor devices and methods of forming same","assignee":null,"inventors":[],"filing_date":"2018-06-29T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["G01C","G01C"],"num_claims":19,"abstract":"A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"MEMS integrated pressure sensor devices and methods of forming same","description":"A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEM","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10508029","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10508029","citation_suggestion":"Patentable. \"MEMS integrated pressure sensor devices and methods of forming same\" (US-10508029). https://patentable.app/patents/US-10508029","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10508029","json":"https://patentable.app/api/llm-context/US-10508029","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:58:06.877Z"}