{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10510586","patent":{"patent_number":"US-10510586","title":"Multi-layer structure having a dense middle layer","assignee":null,"inventors":[],"filing_date":"2018-09-07T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment is a method of fabricating a semiconductor structure. The method includes depositing a hard mask. A multi-layer structure is deposited over the hard mark. The multi-layer structure includes a bottom layer, a first middle layer over the bottom layer, a second middle layer over the first middle layer, and a top layer over the second middle layer. The first middle layer comprises a SiCxHyOz material in which the SiCxHyOz material has a silicon-to-silicon bond content in a range from about 0.5% to about 5%. The multi-layer structure is patterned to form a patterned first middle layer having openings. The hard mask is etched through the openings in the patterned first middle layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-layer structure having a dense middle layer","description":"An embodiment is a method of fabricating a semiconductor structure. The method includes depositing a hard mask. A multi-layer structure is deposited over the hard mark. The multi-layer structure inclu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10510586","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10510586","citation_suggestion":"Patentable. \"Multi-layer structure having a dense middle layer\" (US-10510586). https://patentable.app/patents/US-10510586","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10510586","json":"https://patentable.app/api/llm-context/US-10510586","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:14:55.478Z"}