{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10510591","patent":{"patent_number":"US-10510591","title":"Package-on-package structure and method of manufacturing package","assignee":null,"inventors":[],"filing_date":"2018-08-15T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package-on-package (PoP) structure includes a first package and a second package stacked on the first package. The first package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The die includes an amorphous layer located on the rear surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is on the active surface of the die and is electrically connected to the conductive structures and the die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package-on-package structure and method of manufacturing package","description":"A package-on-package (PoP) structure includes a first package and a second package stacked on the first package. The first package includes a die, a plurality of conductive structures, an encapsulant,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10510591","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10510591","citation_suggestion":"Patentable. \"Package-on-package structure and method of manufacturing package\" (US-10510591). https://patentable.app/patents/US-10510591","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10510591","json":"https://patentable.app/api/llm-context/US-10510591","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:39:29.552Z"}