{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10510643","patent":{"patent_number":"US-10510643","title":"Semiconductor package with lead frame and recessed solder terminals","assignee":null,"inventors":[],"filing_date":"2018-05-14T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device (100) comprising a leadframe (120) having an assembly pad (121) in a first horizontal plane (180), the pad's first surface (121a) with a semiconductor chip (110) attached; further a plurality of leads (122) in a parallel second horizontal plane (190) offset from the first plane in the direction of the attached chip, the leads having a third surface (122a) with bonding wires, and an opposite fourth surface (122b); a package (140) encapsulating leadframe, chip, and wires, the package having a fifth surface (140a) parallel to the first and second planes; a plurality of recess holes (150) in the package, each hole stretching from the fifth surface to the fourth surface of respective leads; and solder (160) filling the recess holes, the solder attached to the fourth lead surface and extending to the fifth package surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with lead frame and recessed solder terminals","description":"A semiconductor device (100) comprising a leadframe (120) having an assembly pad (121) in a first horizontal plane (180), the pad's first surface (121a) with a semiconductor chip (110) attached; furth","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10510643","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10510643","citation_suggestion":"Patentable. \"Semiconductor package with lead frame and recessed solder terminals\" (US-10510643). https://patentable.app/patents/US-10510643","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10510643","json":"https://patentable.app/api/llm-context/US-10510643","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:05:22.227Z"}