{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10510668","patent":{"patent_number":"US-10510668","title":"Method of fabricating semiconductor device","assignee":null,"inventors":[],"filing_date":"2018-07-16T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of fabricating a semiconductor device is provided. A hybrid bonded structure is provided. A cover lid comprising a base portion and at least one dummy portion protruding from the base portion is provided. The at least one dummy portion of the cover lid is bonded to the hybrid bonding structure. The base portion is removed. A redistribution structure over the hybrid bonding structure and the at least one dummy portion is formed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of fabricating semiconductor device","description":"A method of fabricating a semiconductor device is provided. A hybrid bonded structure is provided. A cover lid comprising a base portion and at least one dummy portion protruding from the base portion","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10510668","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10510668","citation_suggestion":"Patentable. \"Method of fabricating semiconductor device\" (US-10510668). https://patentable.app/patents/US-10510668","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10510668","json":"https://patentable.app/api/llm-context/US-10510668","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:15:11.864Z"}