{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10510673","patent":{"patent_number":"US-10510673","title":"Integrated fan-out package and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2018-09-03T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an active surface, a plurality of sidewalls connected to the active surface, and a plurality of pads distributed on the active surface. The insulating encapsulation encapsulates the active surface and the sidewalls of the integrated circuit. The insulating encapsulation includes a plurality of first contact openings and a plurality of through holes, and the pads are exposed by the first contact openings. The redistribution circuit structure includes a redistribution conductive layer, wherein the redistribution conductive layer is disposed on the insulating encapsulation and is distributed in the first contact openings and the through holes. The redistribution conductive layer is electrically connected to the pads through the first contact openings. A method of fabricating the integrated fan-out package is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated fan-out package and method of fabricating the same","description":"An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an active surface, a plu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10510673","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10510673","citation_suggestion":"Patentable. \"Integrated fan-out package and method of fabricating the same\" (US-10510673). https://patentable.app/patents/US-10510673","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10510673","json":"https://patentable.app/api/llm-context/US-10510673","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:51:59.704Z"}