{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10510688","patent":{"patent_number":"US-10510688","title":"Via rail solution for high power electromigration","assignee":null,"inventors":[],"filing_date":"2016-07-19T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure relates to an integrated circuit having a via rail that prevents reliability concerns such as electro-migration. In some embodiments, the integrated circuit has a first plurality of conductive contacts arranged over a semiconductor substrate. A first metal interconnect wire is arranged over the first plurality of conductive contacts, and a second metal interconnect wire is arranged over the first metal interconnect wire. A via rail is arranged over the first metal interconnect wire and electrically couples the first metal interconnect wire and the second metal interconnect wire. The via rail has a length that continuously extends over two or more of the plurality of conductive contacts. The length of via rail provides for an increased cross-sectional area both between the first metal interconnect wire and the second metal interconnect wire and along a length of the via rail, thereby mitigating electro-migration within the integrated circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Via rail solution for high power electromigration","description":"The present disclosure relates to an integrated circuit having a via rail that prevents reliability concerns such as electro-migration. In some embodiments, the integrated circuit has a first pluralit","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10510688","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10510688","citation_suggestion":"Patentable. \"Via rail solution for high power electromigration\" (US-10510688). https://patentable.app/patents/US-10510688","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10510688","json":"https://patentable.app/api/llm-context/US-10510688","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:09:02.181Z"}