{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10510793","patent":{"patent_number":"US-10510793","title":"Uniform-size bonding patterns","assignee":null,"inventors":[],"filing_date":"2018-12-31T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device, and a method of fabrication, is introduced. In an embodiment, one or more passivation layers are formed over a first substrate. Recesses are formed in the passivation layers and a first plurality of bonding pads and a second plurality of bonding pads are formed in the recesses. In an embodiment, the first plurality of bonding pads have a first width and a first pitch, and the second plurality of bonding pads have the first width and are grouped into clusters. The first plurality of bonding pads and the second plurality of bonding pads in the first substrate are aligned to a third plurality of bonding pads in a second substrate and are bonded using a direct bonding method."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Uniform-size bonding patterns","description":"A semiconductor device, and a method of fabrication, is introduced. In an embodiment, one or more passivation layers are formed over a first substrate. Recesses are formed in the passivation layers an","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10510793","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10510793","citation_suggestion":"Patentable. \"Uniform-size bonding patterns\" (US-10510793). https://patentable.app/patents/US-10510793","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10510793","json":"https://patentable.app/api/llm-context/US-10510793","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T12:46:10.546Z"}