{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10512199","patent":{"patent_number":"US-10512199","title":"Power conversion apparatus provided with semiconductor module and electronic component pressurized by pressurizing member","assignee":null,"inventors":[],"filing_date":"2017-09-05T00:00:00.000Z","publication_date":"2019-12-17T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":8,"abstract":"A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power conversion apparatus provided with semiconductor module and electronic component pressurized by pressurizing member","description":"A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10512199","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10512199","citation_suggestion":"Patentable. \"Power conversion apparatus provided with semiconductor module and electronic component pressurized by pressurizing member\" (US-10512199). https://patentable.app/patents/US-10512199","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10512199","json":"https://patentable.app/api/llm-context/US-10512199","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:12:52.692Z"}