{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10514406","patent":{"patent_number":"US-10514406","title":"High resistivity material-based packaging element for electric field sensor","assignee":null,"inventors":[],"filing_date":"2014-08-05T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":15,"abstract":"A high resistivity material-based packaging element for an electric field sensor comprises: a substrate; a first packaging frame fixed to the substrate; and a first packaging cover fixed to the packaging frame; wherein at least one electric field sensor chip is located in an inner cavity formed by the substrate, the first packaging frame, and the first packaging cover, and at least one of the substrate, the first packaging frame, and the first packaging cover is of a high resistivity material having an electrical resistivity equal to or greater than 108Ω·cm. The present invention can ensure accurate measurement of the electric field, and provide an approach to solve the problem of environmental adaptability, thereby enhancing the stability and reliability of electric field detection."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"High resistivity material-based packaging element for electric field sensor","description":"A high resistivity material-based packaging element for an electric field sensor comprises: a substrate; a first packaging frame fixed to the substrate; and a first packaging cover fixed to the packag","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10514406","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10514406","citation_suggestion":"Patentable. \"High resistivity material-based packaging element for electric field sensor\" (US-10514406). https://patentable.app/patents/US-10514406","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10514406","json":"https://patentable.app/api/llm-context/US-10514406","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:48:54.271Z"}