{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515829","patent":{"patent_number":"US-10515829","title":"Package system for integrated circuits","assignee":null,"inventors":[],"filing_date":"2017-02-06T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package system comprising a first interconnect structure arranged over a first surface of a first substrate; a plurality of first through silicon via (TSV) structures in and extending through the first substrate; a molding compound material surrounding the first substrate; at least one through via in the molding compound material with the through via being offset from the first substrate in a direction parallel to the first surface; a second interconnect structure over a second surface of the first substrate; and a first integrated circuit mounted over the first surface of the substrate, with the first integrated circuit being electrically coupled to at least one of the first TSV structures through the first interconnect structure and a connecting bump while the first interconnection structure is electrically coupled to the through via. The first interconnect structure may also be configured for mounting one or more integrated circuits and/or a second interposer on a surface opposite that of the first interposer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package system for integrated circuits","description":"A package system comprising a first interconnect structure arranged over a first surface of a first substrate; a plurality of first through silicon via (TSV) structures in and extending through the fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515829","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515829","citation_suggestion":"Patentable. \"Package system for integrated circuits\" (US-10515829). https://patentable.app/patents/US-10515829","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515829","json":"https://patentable.app/api/llm-context/US-10515829","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:12:49.319Z"}