{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515830","patent":{"patent_number":"US-10515830","title":"First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip","assignee":null,"inventors":[],"filing_date":"2016-11-02T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 μm or more, and the thickness of the curable resin layer is 20 μm to 100 μm."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip","description":"The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515830","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515830","citation_suggestion":"Patentable. \"First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip\" (US-10515830). https://patentable.app/patents/US-10515830","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515830","json":"https://patentable.app/api/llm-context/US-10515830","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:59:41.559Z"}