{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515838","patent":{"patent_number":"US-10515838","title":"Method and apparatus for stacking devices in an integrated circuit assembly","assignee":null,"inventors":[],"filing_date":"2018-11-16T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Methods and apparatuses for stacking devices in an integrated circuit assembly are provided. A tray for supporting multiple dies of a semiconductor material enables both top side processing and bottom side processing of the dies. The dies can be picked and placed for bonding on a substrate or on die stacks without flipping the dies, thereby avoiding particulate debris from the diced edges of the dies from interfering and contaminating the bonding process. In an implementation, a liftoff apparatus directs a pneumatic flow of gas to lift the dies from the tray for bonding to a substrate, and to previously bonded dies, without flipping the dies. An example system allows processing of both top and bottom surfaces of the dies in a single cycle in preparation for bonding, and then pneumatically lifts the dies up to a target substrate so that top sides of the dies bond to bottom sides of dies of the previous batch, in an efficient and flip-free assembly of die stacks."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for stacking devices in an integrated circuit assembly","description":"Methods and apparatuses for stacking devices in an integrated circuit assembly are provided. A tray for supporting multiple dies of a semiconductor material enables both top side processing and bottom","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515838","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515838","citation_suggestion":"Patentable. \"Method and apparatus for stacking devices in an integrated circuit assembly\" (US-10515838). https://patentable.app/patents/US-10515838","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515838","json":"https://patentable.app/api/llm-context/US-10515838","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:19:42.874Z"}