{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515851","patent":{"patent_number":"US-10515851","title":"Method for forming semiconductor device structure with conductive shielding structure","assignee":null,"inventors":[],"filing_date":"2017-09-18T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method for forming a semiconductor device structure is provided. The method includes forming a first hole and a second hole in a first surface of a substrate. The method includes forming a first insulating layer in the first hole and the second hole. The method includes forming a conductive layer over the first insulating layer and in the first hole and the second hole. The method includes forming a second insulating layer over the conductive layer in the first recess. The second insulating layer has a second recess in the first recess. The method includes forming a conductive structure in the second recess. The method includes partially removing the substrate, the first insulating layer, the conductive layer, and the second insulating layer from a second surface of the substrate to expose the conductive structure and the conductive layer in the first hole and the second hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for forming semiconductor device structure with conductive shielding structure","description":"A method for forming a semiconductor device structure is provided. The method includes forming a first hole and a second hole in a first surface of a substrate. The method includes forming a first ins","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515851","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515851","citation_suggestion":"Patentable. \"Method for forming semiconductor device structure with conductive shielding structure\" (US-10515851). https://patentable.app/patents/US-10515851","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515851","json":"https://patentable.app/api/llm-context/US-10515851","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:53:01.579Z"}