{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515870","patent":{"patent_number":"US-10515870","title":"Package carrier having a mesh gas-permeable structure disposed in the through hole","assignee":null,"inventors":[],"filing_date":"2018-07-09T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-permeable structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package carrier having a mesh gas-permeable structure disposed in the through hole","description":"A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515870","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515870","citation_suggestion":"Patentable. \"Package carrier having a mesh gas-permeable structure disposed in the through hole\" (US-10515870). https://patentable.app/patents/US-10515870","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515870","json":"https://patentable.app/api/llm-context/US-10515870","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:18:35.693Z"}