{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515882","patent":{"patent_number":"US-10515882","title":"Semiconductor device package including electrode solder pads and additional solder pads","assignee":null,"inventors":[],"filing_date":"2017-12-22T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":22,"abstract":"A package for a semiconductor device includes: a plate-shaped base member having a substantially rectangular shape in a plan view; a first and second electrode solder pads configured to be electrically connected to a semiconductor element when the semiconductor element is mounted on an upper surface of the base member, the electrode solder pads being disposed at a lower surface side of the base member to face each other in a first direction; and first and second auxiliary solder pads disposed on a lower surface of the base member, the auxiliary solder pads being disposed at both sides of the electrode solder pads such that the first and second electrode solder pads are disposed between the first and second auxiliary solder pads in a plan view."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package including electrode solder pads and additional solder pads","description":"A package for a semiconductor device includes: a plate-shaped base member having a substantially rectangular shape in a plan view; a first and second electrode solder pads configured to be electricall","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515882","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515882","citation_suggestion":"Patentable. \"Semiconductor device package including electrode solder pads and additional solder pads\" (US-10515882). https://patentable.app/patents/US-10515882","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515882","json":"https://patentable.app/api/llm-context/US-10515882","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:35:57.839Z"}