{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515898","patent":{"patent_number":"US-10515898","title":"Circuit board incorporating semiconductor IC and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2018-05-14T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Disclosed herein is a circuit board that includes a first insulating layer having an upper surface; a first wiring layer embedded in the first insulating layer, the first wiring layer having an upper surface exposed from the upper surface of the first insulating layer such that the upper surface of the first wiring layer is substantially coplanar with the upper surface of the first insulating layer; a semiconductor IC mounted on the upper surface of the first wiring layer with a die attach material interposed therebetween; and a second insulating layer stacked on the upper surface of the first wiring layer so as to embed the semiconductor IC, wherein a bottom surface of the die attach material is in contact with both of the upper surface of the first insulating layer and the upper surface of the first wiring layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Circuit board incorporating semiconductor IC and manufacturing method thereof","description":"Disclosed herein is a circuit board that includes a first insulating layer having an upper surface; a first wiring layer embedded in the first insulating layer, the first wiring layer having an upper ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515898","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515898","citation_suggestion":"Patentable. \"Circuit board incorporating semiconductor IC and manufacturing method thereof\" (US-10515898). https://patentable.app/patents/US-10515898","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515898","json":"https://patentable.app/api/llm-context/US-10515898","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:47:22.299Z"}