{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515904","patent":{"patent_number":"US-10515904","title":"Method for forming chip package structure","assignee":null,"inventors":[],"filing_date":"2018-12-21T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Methods for forming chip package structures are provided. The method includes disposing a first chip structure, a second chip structure over a carrier substrate and forming a molding compound layer surrounding the first chip structure and the second chip structure. The method includes forming a dielectric structure over the molding compound layer and a first grounding line in the dielectric structure and cutting the first grounding line to form a first end enlarged portion of the first grounding line. In addition, the first end enlarged portion has a gradually increased thickness."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for forming chip package structure","description":"Methods for forming chip package structures are provided. The method includes disposing a first chip structure, a second chip structure over a carrier substrate and forming a molding compound layer su","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515904","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515904","citation_suggestion":"Patentable. \"Method for forming chip package structure\" (US-10515904). https://patentable.app/patents/US-10515904","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515904","json":"https://patentable.app/api/llm-context/US-10515904","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:35:39.055Z"}