{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10515936","patent":{"patent_number":"US-10515936","title":"Package structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2018-06-25T00:00:00.000Z","publication_date":"2019-12-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A package structure includes a first redistribution structure, a die, a plurality of conductive sheets, a plurality of conductive balls, and a first encapsulant. The first redistribution structure has a first surface and a second surface opposite to the first surface. The die has a plurality of connection pads electrically connected to the first surface of the first redistribution structure. The conductive sheets are electrically connected to the first surface of the first redistribution structure. The conductive balls are correspondingly disposed on the conductive sheets and are electrically coupled to the first surface of the first redistribution structure through the conductive sheets. The first encapsulant encapsulates the die, the conductive sheets, and the conductive balls. The first encapsulant exposes at least a portion of each conductive ball."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and manufacturing method thereof","description":"A package structure includes a first redistribution structure, a die, a plurality of conductive sheets, a plurality of conductive balls, and a first encapsulant. The first redistribution structure has","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10515936","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10515936","citation_suggestion":"Patentable. \"Package structure and manufacturing method thereof\" (US-10515936). https://patentable.app/patents/US-10515936","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10515936","json":"https://patentable.app/api/llm-context/US-10515936","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:16:24.237Z"}