{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10519037","patent":{"patent_number":"US-10519037","title":"Multipass transfer surface for dynamic assembly","assignee":null,"inventors":[],"filing_date":"2016-01-18T00:00:00.000Z","publication_date":"2019-12-31T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":15,"abstract":"An intermediate transfer surface includes a substrate, a two-dimensional array of electrodes, a dielectric spacer layer on the two-dimensional array of electrodes, and a voltage controller electrically connected to the array of electrodes. A method of manufacturing an intermediate transfer surface, depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A microassembly system includes an assembly surface having a first two dimensional array of potential wells on a first surface, a first voltage source electrically connected to the first array of potential wells, an intermediate transfer surface having a second two dimensional array of potential wells on a second surface arranged to face the first surface, and a second voltage source electrically connected to the second array of potential wells."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multipass transfer surface for dynamic assembly","description":"An intermediate transfer surface includes a substrate, a two-dimensional array of electrodes, a dielectric spacer layer on the two-dimensional array of electrodes, and a voltage controller electricall","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10519037","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10519037","citation_suggestion":"Patentable. \"Multipass transfer surface for dynamic assembly\" (US-10519037). https://patentable.app/patents/US-10519037","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10519037","json":"https://patentable.app/api/llm-context/US-10519037","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:33:10.680Z"}