{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10522439","patent":{"patent_number":"US-10522439","title":"Semiconductor package device","assignee":null,"inventors":[],"filing_date":"2018-05-17T00:00:00.000Z","publication_date":"2019-12-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a die having a pad, a passivation disposed aver the die and a portion of the pad, a polymer disposed over the passivation, a molding surrounding the die and the polymer, and an interface between the polymer and the molding. The interface and the passivation define an angle less than or greater than approximately 90°."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package device","description":"A semiconductor device includes a die having a pad, a passivation disposed aver the die and a portion of the pad, a polymer disposed over the passivation, a molding surrounding the die and the polymer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10522439","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10522439","citation_suggestion":"Patentable. \"Semiconductor package device\" (US-10522439). https://patentable.app/patents/US-10522439","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10522439","json":"https://patentable.app/api/llm-context/US-10522439","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:24:17.771Z"}