{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10522457","patent":{"patent_number":"US-10522457","title":"Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates","assignee":null,"inventors":[],"filing_date":"2019-01-03T00:00:00.000Z","publication_date":"2019-12-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, one or more conductive features (120E.A, 120E.B, or both) are provided above the substrate that wrap around the conductive vias' protrusions (114′) to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates","description":"In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, one or more conductive features (120E.A, 120E.B, or both) are provided","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10522457","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10522457","citation_suggestion":"Patentable. \"Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates\" (US-10522457). https://patentable.app/patents/US-10522457","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10522457","json":"https://patentable.app/api/llm-context/US-10522457","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:25:35.470Z"}