{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10522477","patent":{"patent_number":"US-10522477","title":"Method of making package assembly including stress relief structures","assignee":null,"inventors":[],"filing_date":"2017-11-13T00:00:00.000Z","publication_date":"2019-12-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of making a semiconductor package structure includes bonding a plurality of dies to a substrate, wherein a first die of the plurality of dies is larger than a second die of the plurality of dies. The method further includes adhering a first stress relief structure to the substrate at a corner of the substrate, wherein a distance between the first stress relief structure to a closest die of the plurality of dies to the first stress relief structure is a first distance. The method further includes adhering a second stress relief structure to the substrate along a single edge of the substrate, wherein a distance between the second stress relief structure to a closest die of the plurality of dies to the second stress relief structure is the first distance."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of making package assembly including stress relief structures","description":"A method of making a semiconductor package structure includes bonding a plurality of dies to a substrate, wherein a first die of the plurality of dies is larger than a second die of the plurality of d","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10522477","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10522477","citation_suggestion":"Patentable. \"Method of making package assembly including stress relief structures\" (US-10522477). https://patentable.app/patents/US-10522477","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10522477","json":"https://patentable.app/api/llm-context/US-10522477","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:24:48.991Z"}