{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10522484","patent":{"patent_number":"US-10522484","title":"Wiring substrate","assignee":null,"inventors":[],"filing_date":"2018-05-01T00:00:00.000Z","publication_date":"2019-12-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post. The thin film capacitor includes a reference hole extending through the thin film capacitor in a thickness-wise direction. The post is inserted through the reference hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate","description":"A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10522484","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10522484","citation_suggestion":"Patentable. \"Wiring substrate\" (US-10522484). https://patentable.app/patents/US-10522484","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10522484","json":"https://patentable.app/api/llm-context/US-10522484","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:20:16.232Z"}