{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10522512","patent":{"patent_number":"US-10522512","title":"Semiconductor package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2018-05-02T00:00:00.000Z","publication_date":"2019-12-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor package including an ultra-thin redistribution structure, a semiconductor die, a first insulating encapsulant, a semiconductor chip stack, and a second insulating encapsulant is provided. The semiconductor die is disposed on and electrically coupled to the ultra-thin redistribution structure. The first insulating encapsulant is disposed on the ultra-thin redistribution structure and encapsulates the semiconductor die. The semiconductor chip stack is disposed on the first insulating encapsulant and electrically coupled to the ultra-thin redistribution structure. The second insulating encapsulant is disposed on the ultra-thin redistribution structure and encapsulates the semiconductor chip stack and the first insulating encapsulant. A manufacturing method of a semiconductor package is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method thereof","description":"A semiconductor package including an ultra-thin redistribution structure, a semiconductor die, a first insulating encapsulant, a semiconductor chip stack, and a second insulating encapsulant is provid","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10522512","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10522512","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method thereof\" (US-10522512). https://patentable.app/patents/US-10522512","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10522512","json":"https://patentable.app/api/llm-context/US-10522512","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:12:02.130Z"}