{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10528103","patent":{"patent_number":"US-10528103","title":"Die interconnect signal management devices and methods","assignee":null,"inventors":[],"filing_date":"2017-06-14T00:00:00.000Z","publication_date":"2020-01-07T00:00:00.000Z","cpc_codes":["G06F","G06F","H04B","H04B"],"num_claims":21,"abstract":"A microelectronic assembly may include a first microelectronic device, a second microelectronic device, a first signal link, a second signal link, and a first power connection. The first microelectronic device may include a first interface powered at a first voltage. The second microelectronic device may include a second interface powered at a second voltage. The first signal link may supply a first signal at the first voltage from the first interface to the second interface. The second signal link may supply a second signal at the second voltage from the second interface to the first interface. The first power connection may supply a first reference signal at the first voltage from the first interface to the second interface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Die interconnect signal management devices and methods","description":"A microelectronic assembly may include a first microelectronic device, a second microelectronic device, a first signal link, a second signal link, and a first power connection. The first microelectron","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10528103","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10528103","citation_suggestion":"Patentable. \"Die interconnect signal management devices and methods\" (US-10528103). https://patentable.app/patents/US-10528103","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10528103","json":"https://patentable.app/api/llm-context/US-10528103","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:42:00.817Z"}