{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10529663","patent":{"patent_number":"US-10529663","title":"Copper interconnect with filled void","assignee":null,"inventors":[],"filing_date":"2018-10-14T00:00:00.000Z","publication_date":"2020-01-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Voids within metal deposited on interconnect structures are filled with cobalt or a cobalt compound to enhance electromigration performance. A reflow process to enlarge interconnect metal grain size is performed prior to filling the voids. An interconnect metal microstructure beneath the filled voids includes grain boundaries extending to the bottom portions of the voids. A coating of manganese atoms provides resistance to electromigration. Copper interconnects having fine dimensions and improved reliability are obtained."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Copper interconnect with filled void","description":"Voids within metal deposited on interconnect structures are filled with cobalt or a cobalt compound to enhance electromigration performance. A reflow process to enlarge interconnect metal grain size i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10529663","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10529663","citation_suggestion":"Patentable. \"Copper interconnect with filled void\" (US-10529663). https://patentable.app/patents/US-10529663","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10529663","json":"https://patentable.app/api/llm-context/US-10529663","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T02:19:44.122Z"}