{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10529669","patent":{"patent_number":"US-10529669","title":"Shielded module having compression overmold","assignee":null,"inventors":[],"filing_date":"2018-07-07T00:00:00.000Z","publication_date":"2020-01-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Shielded module having compression overmold","description":"A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10529669","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10529669","citation_suggestion":"Patentable. \"Shielded module having compression overmold\" (US-10529669). https://patentable.app/patents/US-10529669","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10529669","json":"https://patentable.app/api/llm-context/US-10529669","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:20:53.709Z"}