{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10529677","patent":{"patent_number":"US-10529677","title":"Method and apparatus for power delivery to a die stack via a heat spreader","assignee":null,"inventors":[],"filing_date":"2018-04-27T00:00:00.000Z","publication_date":"2020-01-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost semiconductor chip. A heat spreader is positioned on the uppermost semiconductor chip. A power transfer circuit is configured to transfer electric power from the heat spreader to the uppermost semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for power delivery to a die stack via a heat spreader","description":"Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10529677","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10529677","citation_suggestion":"Patentable. \"Method and apparatus for power delivery to a die stack via a heat spreader\" (US-10529677). https://patentable.app/patents/US-10529677","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10529677","json":"https://patentable.app/api/llm-context/US-10529677","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:39:15.277Z"}