{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10529698","patent":{"patent_number":"US-10529698","title":"Semiconductor packages and methods of forming same","assignee":null,"inventors":[],"filing_date":"2017-09-01T00:00:00.000Z","publication_date":"2020-01-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment is a package including a first package structure. The first package structure includes a first integrated circuit die having an active side and a back-side, the active side comprising die connectors, a first electrical connector adjacent the first integrated circuit die, an encapsulant laterally encapsulating the first integrated circuit die and the first electrical connector, a first redistribution structure on and electrically connected to the die connectors of the first integrated circuit die and the first electrical connector, and thermal elements on the back-side of the first integrated circuit die. The package further includes a second package structure bonded to the first electrical connector and the thermal elements with a first set of conductive connectors."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages and methods of forming same","description":"An embodiment is a package including a first package structure. The first package structure includes a first integrated circuit die having an active side and a back-side, the active side comprising di","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10529698","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10529698","citation_suggestion":"Patentable. \"Semiconductor packages and methods of forming same\" (US-10529698). https://patentable.app/patents/US-10529698","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10529698","json":"https://patentable.app/api/llm-context/US-10529698","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:35:05.152Z"}