{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10531556","patent":{"patent_number":"US-10531556","title":"Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly","assignee":null,"inventors":[],"filing_date":"2018-01-29T00:00:00.000Z","publication_date":"2020-01-07T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":16,"abstract":"A method of assembling a component to a printed circuit board that includes a thermal layer and a circuit layer separated by a dielectric layer. The circuit layer includes circuit pads that correspond to terminal surfaces on the component. The dielectric layer includes an aperture that exposes a portion of the thermal layer that correspond to a thermal pad on the component. Solder paste is applied to the circuit pads and the exposed thermal layer. Lower surfaces of the solder paste are in contact with the circuit pads and the thermal layer and upper surfaces of the solder paste are substantially coplanar. The component is placed on the solder paste. The printed circuit board and the component are heated to create solder joints between the terminal surfaces on the component and the circuit pads and between the thermal pad on the component and the thermal layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly","description":"A method of assembling a component to a printed circuit board that includes a thermal layer and a circuit layer separated by a dielectric layer. The circuit layer includes circuit pads that correspond","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10531556","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10531556","citation_suggestion":"Patentable. \"Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly\" (US-10531556). https://patentable.app/patents/US-10531556","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10531556","json":"https://patentable.app/api/llm-context/US-10531556","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:08:16.365Z"}