{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10535378","patent":{"patent_number":"US-10535378","title":"Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assemblies","assignee":null,"inventors":[],"filing_date":"2018-07-19T00:00:00.000Z","publication_date":"2020-01-14T00:00:00.000Z","cpc_codes":["G11C","G11C"],"num_claims":22,"abstract":"Some embodiments include an integrated assembly which has digit-line-contact-regions laterally spaced from one another by intervening regions. Non-conductive-semiconductor-material is over the intervening regions. Openings extend through the non-conductive-semiconductor-material to the digit-line-contact-regions. Conductive-semiconductor-material-interconnects are within the openings and are coupled with the digit-line-contact-regions. Upper surfaces of the conductive-semiconductor-material-interconnects are beneath a lower surface of the non-conductive-semiconductor-material. Metal-containing-digit-lines are over the non-conductive-semiconductor-material. Conductive regions extend downwardly from the metal-containing-digit-lines to couple with the conductive-semiconductor-material-interconnects. Some embodiments include methods of forming integrated assemblies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assemblies","description":"Some embodiments include an integrated assembly which has digit-line-contact-regions laterally spaced from one another by intervening regions. Non-conductive-semiconductor-material is over the interve","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10535378","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10535378","citation_suggestion":"Patentable. \"Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assemblies\" (US-10535378). https://patentable.app/patents/US-10535378","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10535378","json":"https://patentable.app/api/llm-context/US-10535378","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:34:11.522Z"}