{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10535585","patent":{"patent_number":"US-10535585","title":"Integrated passive device and fabrication method using a last through-substrate via","assignee":null,"inventors":[],"filing_date":"2017-11-15T00:00:00.000Z","publication_date":"2020-01-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"In one general aspect, an integrated passive device (IPD) die includes at least one passive component that is embedded in an insulator material disposed on a front surface of a substrate. The IPD die includes a through-substrate via (TSV) extending from the backside of the substrate toward the front surface of the substrate. The TSV defines interconnect access to at least one passive component embedded in the insulator material disposed on the front surface of the substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated passive device and fabrication method using a last through-substrate via","description":"In one general aspect, an integrated passive device (IPD) die includes at least one passive component that is embedded in an insulator material disposed on a front surface of a substrate. The IPD die ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10535585","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10535585","citation_suggestion":"Patentable. \"Integrated passive device and fabrication method using a last through-substrate via\" (US-10535585). https://patentable.app/patents/US-10535585","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10535585","json":"https://patentable.app/api/llm-context/US-10535585","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:11:07.183Z"}