{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10535589","patent":{"patent_number":"US-10535589","title":"Clip structure and semiconductor package using the same","assignee":null,"inventors":[],"filing_date":"2018-07-13T00:00:00.000Z","publication_date":"2020-01-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A clip structure and a semiconductor package using the same include different metals in multiple layers so as to selectively, easily and exactly fix semiconductor chips, which consists of a lightweight material so as to lighten the weight of semiconductor packages and to help reduce manufacturing costs, and which in particular, maintains the width of a self-welding layer consisting of a clip structure so as to help improve the quality of adhesion. That is, according to a clip structure of the present invention, which electrically connects package elements in a semiconductor package, the clip structure includes a main metallic layer that is configured to maintain a shape, and a first functional layer that is piled on one surface of the main metallic layer and consists of a metal different from that of the main metal layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Clip structure and semiconductor package using the same","description":"A clip structure and a semiconductor package using the same include different metals in multiple layers so as to selectively, easily and exactly fix semiconductor chips, which consists of a lightweigh","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10535589","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10535589","citation_suggestion":"Patentable. \"Clip structure and semiconductor package using the same\" (US-10535589). https://patentable.app/patents/US-10535589","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10535589","json":"https://patentable.app/api/llm-context/US-10535589","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:05:55.506Z"}