{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10535597","patent":{"patent_number":"US-10535597","title":"Semiconductor structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2017-12-21T00:00:00.000Z","publication_date":"2020-01-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides a semiconductor package device, which includes an interposer die. The interposer die includes a semiconductor substrate and a plurality of through-silicon-vias (TSVs) extending through the semiconductor substrate. The semiconductor package device also includes a semiconductor die spaced apart from the interposer die, a first redistribution layer disposed on a first side of the interposer die and electrically coupling the interposer die with the semiconductor die, and a second redistribution layer on a second side of the interposer die opposite the first side."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor structure and manufacturing method thereof","description":"The present disclosure provides a semiconductor package device, which includes an interposer die. The interposer die includes a semiconductor substrate and a plurality of through-silicon-vias (TSVs) e","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10535597","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10535597","citation_suggestion":"Patentable. \"Semiconductor structure and manufacturing method thereof\" (US-10535597). https://patentable.app/patents/US-10535597","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10535597","json":"https://patentable.app/api/llm-context/US-10535597","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:16:55.721Z"}