{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10536658","patent":{"patent_number":"US-10536658","title":"Image sensor having stacked imaging and digital wafers where the digital wafer has stacked capacitors and logic circuitry","assignee":null,"inventors":[],"filing_date":"2018-09-11T00:00:00.000Z","publication_date":"2020-01-14T00:00:00.000Z","cpc_codes":["H04N","H04N","H04N","H04N","H04N","H04N","H04N"],"num_claims":28,"abstract":"An electronic device includes a first integrated circuit die having formed therein photodiodes and readout circuitry for the photodiodes, with the readout circuitry including output pads exposed on a surface of the first integrated circuit die. A second integrated circuit die has formed therein storage capacitor structures for the photodiodes and digital circuitry for performing image processing on data stored in the storage capacitor structures, with the storage capacitor structures including input pads exposed on a surface of the second integrated circuit die. The first and second integrated circuit die are in a face to face arrangement such that the output pads of the first integrated circuit die face the input pads of the second integrated circuit die. An interconnect couples the output pads of the first integrated circuit die to the input pads of the second integrated circuit die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Image sensor having stacked imaging and digital wafers where the digital wafer has stacked capacitors and logic circuitry","description":"An electronic device includes a first integrated circuit die having formed therein photodiodes and readout circuitry for the photodiodes, with the readout circuitry including output pads exposed on a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10536658","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10536658","citation_suggestion":"Patentable. \"Image sensor having stacked imaging and digital wafers where the digital wafer has stacked capacitors and logic circuitry\" (US-10536658). https://patentable.app/patents/US-10536658","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10536658","json":"https://patentable.app/api/llm-context/US-10536658","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:36:06.372Z"}