{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10537044","patent":{"patent_number":"US-10537044","title":"Heat dissipating  component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system","assignee":null,"inventors":[],"filing_date":"2016-07-20T00:00:00.000Z","publication_date":"2020-01-14T00:00:00.000Z","cpc_codes":["G08G","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A heat dissipating component comprising: a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that is provided at the main body, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to an electronic component; and a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat dissipating  component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system","description":"A heat dissipating component comprising: a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first mate","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10537044","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10537044","citation_suggestion":"Patentable. \"Heat dissipating  component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system\" (US-10537044). https://patentable.app/patents/US-10537044","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10537044","json":"https://patentable.app/api/llm-context/US-10537044","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:46:12.931Z"}