{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541149","patent":{"patent_number":"US-10541149","title":"Gettering layer forming method","assignee":null,"inventors":[],"filing_date":"2018-05-04T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a drying step of drying the wafer after performing the coating step, thereby forming a gettering layer containing the metal salt on the back side of the wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Gettering layer forming method","description":"A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a drying step of drying the wafer after performing the coating step, thereb","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541149","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541149","citation_suggestion":"Patentable. \"Gettering layer forming method\" (US-10541149). https://patentable.app/patents/US-10541149","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541149","json":"https://patentable.app/api/llm-context/US-10541149","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:41:54.993Z"}