{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541190","patent":{"patent_number":"US-10541190","title":"Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material","assignee":null,"inventors":[],"filing_date":"2015-11-30T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"An apparatus is described that includes a first semiconductor die. A second semiconductor die is stacked on the first semiconductor die. The first semiconductor die has a larger surface area than the second semiconductor die such that there exists a peripheral region of the first semiconductor die that is not covered by the second semiconductor die. The apparatus includes thermally conductive material above the second semiconductor die. The apparatus includes a compound mold between the thermally conductive material and both the second semiconductor die and the peripheral region of the first semiconductor die. The apparatus includes a thermally conductive structure extending through the compound mold that thermally couples the peripheral region to the thermally conductive material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material","description":"An apparatus is described that includes a first semiconductor die. A second semiconductor die is stacked on the first semiconductor die. The first semiconductor die has a larger surface area than the ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541190","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541190","citation_suggestion":"Patentable. \"Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material\" (US-10541190). https://patentable.app/patents/US-10541190","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541190","json":"https://patentable.app/api/llm-context/US-10541190","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:38:42.630Z"}