{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541194","patent":{"patent_number":"US-10541194","title":"Semiconductor package with interconnected leads","assignee":null,"inventors":[],"filing_date":"2018-03-23T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor package includes a semiconductor die and a ceramic package body covering the semiconductor die. The ceramic package body includes a plurality of contact pads. Each of a first plurality of leads includes a top portion and a bottom portion. The top portion of each of the first plurality of leads is electrically connected to a contact pad of the plurality of contact pads. Each of a second plurality of leads includes a top portion and a bottom portion and an interconnection portion between the top portion and the bottom portion. The top portion of each of the second plurality of leads includes separate finger portions that are electrically connected to at least two of the plurality of contact pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with interconnected leads","description":"A semiconductor package includes a semiconductor die and a ceramic package body covering the semiconductor die. The ceramic package body includes a plurality of contact pads. Each of a first plurality","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541194","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541194","citation_suggestion":"Patentable. \"Semiconductor package with interconnected leads\" (US-10541194). https://patentable.app/patents/US-10541194","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541194","json":"https://patentable.app/api/llm-context/US-10541194","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:09:03.842Z"}