{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541197","patent":{"patent_number":"US-10541197","title":"Press-fit pin and semiconductor package including the same","assignee":null,"inventors":[],"filing_date":"2018-07-18T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A press-fit pin increases contact area with the contact hole to provide appropriate contact pressure, reduce contact resistance, and increase heat transfer efficiency. The press-fit pin is of a semiconductor package including an end portion and a press unit extending from the end portion and is divided into a first press-fitting piece and a second press-fitting piece, the first press-fitting piece forming a convex portion in a first direction perpendicular to the direction of the press-fit pin and bending to a second direction perpendicular to the direction of the press-fit pin and forming 30-110 degrees with the first direction and the second press-fitting piece forming a convex portion in a third direction perpendicular to the direction of the press-fit pin and being 180 degrees with the first direction and bending to a fourth direction perpendicular to the direction of the press-fit pin and forming 250-330 degrees with the first direction."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Press-fit pin and semiconductor package including the same","description":"A press-fit pin increases contact area with the contact hole to provide appropriate contact pressure, reduce contact resistance, and increase heat transfer efficiency. The press-fit pin is of a semico","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541197","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541197","citation_suggestion":"Patentable. \"Press-fit pin and semiconductor package including the same\" (US-10541197). https://patentable.app/patents/US-10541197","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541197","json":"https://patentable.app/api/llm-context/US-10541197","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:15:55.277Z"}