{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541199","patent":{"patent_number":"US-10541199","title":"BEOL integration with advanced interconnects","assignee":null,"inventors":[],"filing_date":"2017-11-29T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"An alloy liner is located on a diffusion barrier liner and both are present in at least a via portion of a combined via/line opening that is present in an interconnect dielectric material. The alloy liner includes an alloy of a first metal or metal alloy having a first bulk resistivity and a second metal or metal alloy having a second bulk resistivity that is higher than the first bulk resistivity. A first electrically conductive structure is located on the alloy liner and is present in at least the via portion of the combined via/line opening. The first electrically conductive structure includes the second metal or metal alloy. A second electrically conductive structure can be present in at least the line portion of the combined via/line opening. The second electrically conductive structure may include a metal or metal alloy having the first or second bulk resistivity."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"BEOL integration with advanced interconnects","description":"An alloy liner is located on a diffusion barrier liner and both are present in at least a via portion of a combined via/line opening that is present in an interconnect dielectric material. The alloy l","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541199","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541199","citation_suggestion":"Patentable. \"BEOL integration with advanced interconnects\" (US-10541199). https://patentable.app/patents/US-10541199","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541199","json":"https://patentable.app/api/llm-context/US-10541199","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:36:30.783Z"}