{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541201","patent":{"patent_number":"US-10541201","title":"Semiconductor package, package-on-package device, and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2018-09-20T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package including a package substrate, a semiconductor chip on a first surface of the package substrate, a connection substrate on the package substrate and spaced apart from and surrounding the semiconductor chip, the connection substrate including a plurality of conductive connection structures penetrating therethrough, a plurality of first connecting elements between the semiconductor chip and the package substrate and electrically connecting the semiconductor chip to the package substrate, a plurality of second connecting elements between the connection substrate and the package substrate and electrically connecting the connection substrate to package substrate, a mold layer encapsulating the semiconductor chip and the connection substrate, and an upper redistribution pattern on the mold layer and the semiconductor chip and electrically connected to a corresponding one of the plurality of conductive connection structures may be provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package, package-on-package device, and method of fabricating the same","description":"A semiconductor package including a package substrate, a semiconductor chip on a first surface of the package substrate, a connection substrate on the package substrate and spaced apart from and surro","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541201","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541201","citation_suggestion":"Patentable. \"Semiconductor package, package-on-package device, and method of fabricating the same\" (US-10541201). https://patentable.app/patents/US-10541201","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541201","json":"https://patentable.app/api/llm-context/US-10541201","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T08:44:24.634Z"}