{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541204","patent":{"patent_number":"US-10541204","title":"Interconnection structure and method of forming the same","assignee":null,"inventors":[],"filing_date":"2015-12-29T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An interconnection structure includes a non-insulator structure, a dielectric structure, and a conductive structure. The dielectric structure is present on the non-insulator structure. The dielectric structure has a trench opening and a via opening therein. The trench opening has a bottom surface and at least one recess in the bottom surface. The via opening is present between the trench opening and the non-insulator structure. The conductive structure is present in the trench opening and the via opening and electrically connected to the non-insulator structure. The conductive structure is at least separated from the bottom of the recess."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnection structure and method of forming the same","description":"An interconnection structure includes a non-insulator structure, a dielectric structure, and a conductive structure. The dielectric structure is present on the non-insulator structure. The dielectric ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541204","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541204","citation_suggestion":"Patentable. \"Interconnection structure and method of forming the same\" (US-10541204). https://patentable.app/patents/US-10541204","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541204","json":"https://patentable.app/api/llm-context/US-10541204","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:37:06.376Z"}