{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541205","patent":{"patent_number":"US-10541205","title":"Manufacture of interconnects for integration of multiple integrated circuits","assignee":null,"inventors":[],"filing_date":"2017-02-14T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Fabrication methods for monolithic dies that integrate multiple integrated circuits, such as System-on-Chips are described. A substrate having an interconnect may be coupled via electrical terminations to the integrated circuits. Fabrication methods provide multiple electrical termination regions on a surface, with each region having geometrical properties that are appropriate for the coupled integrated circuit. Electrical terminations with different directions may be produced employing a single reactive ion etching process under conditions that enhance micro loading effects during fabrication."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacture of interconnects for integration of multiple integrated circuits","description":"Fabrication methods for monolithic dies that integrate multiple integrated circuits, such as System-on-Chips are described. A substrate having an interconnect may be coupled via electrical termination","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541205","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541205","citation_suggestion":"Patentable. \"Manufacture of interconnects for integration of multiple integrated circuits\" (US-10541205). https://patentable.app/patents/US-10541205","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541205","json":"https://patentable.app/api/llm-context/US-10541205","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:10:27.629Z"}