{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541226","patent":{"patent_number":"US-10541226","title":"Package structure and method of forming the same","assignee":null,"inventors":[],"filing_date":"2016-10-03T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"An embodiment is a structure including a first die, a molding compound at least laterally encapsulating the first die, a first redistribution structure including metallization patterns extending over the first die and the molding compound, a first conductive connector comprising a solder ball and an under bump metallization coupled to the first redistribution structure, and an integrated passive device bonded to a first metallization pattern in the first redistribution structure with a micro bump bonding joint, the integrated passive device being adjacent the first conductive connector."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and method of forming the same","description":"An embodiment is a structure including a first die, a molding compound at least laterally encapsulating the first die, a first redistribution structure including metallization patterns extending over ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541226","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541226","citation_suggestion":"Patentable. \"Package structure and method of forming the same\" (US-10541226). https://patentable.app/patents/US-10541226","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541226","json":"https://patentable.app/api/llm-context/US-10541226","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:34:02.344Z"}