{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10541262","patent":{"patent_number":"US-10541262","title":"Image sensing chip packaging structure and packaging method","assignee":null,"inventors":[],"filing_date":"2016-09-19T00:00:00.000Z","publication_date":"2020-01-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A package for an image sensing chip is provided, which includes: an image sensing chip comprising a first surface and a second surface opposite to each other, where the first surface is provided with an image sensing region and a contact pad; a through hole extending from the second surface to the contact pad; an electrical connection layer provided along an inner wall of the through hole and extending onto the second surface; a solder mask filling the through hole and covering the electrical connection layer, wherein an opening is formed in the solder mask, and the electrical connection layer is exposed at a bottom of the opening; a guide contact pad covering an inner wall and the bottom of the opening and extending onto the solder mask; and a solder bump located on the guide contact pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Image sensing chip packaging structure and packaging method","description":"A package for an image sensing chip is provided, which includes: an image sensing chip comprising a first surface and a second surface opposite to each other, where the first surface is provided with ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10541262","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10541262","citation_suggestion":"Patentable. \"Image sensing chip packaging structure and packaging method\" (US-10541262). https://patentable.app/patents/US-10541262","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10541262","json":"https://patentable.app/api/llm-context/US-10541262","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T08:00:06.791Z"}